Automatic, reliable film thickness mapping for up to 300 mm wafersThe wafer mapping unit is capable of automatically mapping film thickness measurement over the entire surface of wafers up to 300 mm. The automatic alignment function, self-calibration function, and high flatness wafer chuck enable highly reliable film thickness measurement. This unit is used in combination with the compact film thickness monitor. It can be installed at the load port of semiconductor manufacturing equipment to control the film thickness on the manufacturing equipment while maintaining cleanliness.
1.Automatic film thickness mapping measurement of up to 300 mm wafer is possible. 2. Automatic alignment function
High-precision measurement is realized by automatic detection of the function of notch orientation flat position and automatic detection of the function of wafer eccentricity.
3. Automatic calibration functionIt is unnecessary to prepare calibration wafers equipped with silicon ports and dark ports inside of the device.
4. Improved measurement reliability in the wafer surface by adopting a wafer chuck with high flatness 5. Supports automationIt can be connected to a pick-up robot for automatic wafer handling.
6. Load port installation (option)Example of measurement data
Configuration
| Specification | |
|---|---|
| Installation type | Stand-alone |
| Target substrate | 100 mm, 125 mm, 150 mm, 200 mm, 300 mm Wafer with film |
| Light source | Selectable below 3 kinds ・ Deuterium Halogen lamp ・ Halogen lamp ・ White color LED |
| Measurement distance | Max 60 mm |
| Beam spot | About 3 mmø (Option 1 mmø, but in case, it enables to do alignment) |
| Film thickness range | 10 nm - 50 nm |
| Max film layer | Max 9 layers |
| Repeatability | ≦ 0.1 nm |
| Analysis | Curve fitting method FFT method Peak detection method |
| Measurement time | ≦1 sec/point |
| Data transfer | USB 2.0 Cable ・ For data input ・ For Stage control |
| Power | Notebook PC 100-240 VAC Max 2A Main Body 100-240 VAC Max 2A Automatic stage part 100-240 VAC Max 2 A |
| Weight | Notebook PC about 3 kg Main body about 4 kg Automatic stage part about 20 kg |
| Measurement | Main body (L) about 150 x (W) 160 x (H) 110 mm In case of Deuterium Halogen lamp use Stage part (L) about 500 x (W) 340 x (H) 270 mm |
| Automatic stage spec | Linear stage Moving area:300 mm Resolution:4μm Max speed:40 mm/sec. Rotating stage Moving area:2-400 degrees Resolution:0.005° Max speed:30°/sec. PC transmit RS-232C (USB cable) |
| Monitor display | Display film thickness on real time basis Mapping measurement result on graph display Statistic calculation result display |
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